Autodesk, Taiwan Architecture and Building Center partner to develop smart building sector

July 02, 2025

Chin-Fu Yang, Chairman of the Taiwan Architecture and Building Center (left), and Richard Li, Managing Director of Autodesk Greater China (right), sign the MoU to foster talent in the smart building sector in Taiwan.

Autodesk has taken a significant step forward by signing a Memorandum of Understanding (MoU) with the Taiwan Architecture and Building Center (TABC). This collaboration is aimed at empowering the AEC industry in Taiwan to embrace digital transformation and enhance capabilities in smart buildings and intelligent construction. The partnership will focus on promoting tools like Fusion 360 and BIM through training programs, innovation initiatives, and knowledge sharing. Fusion 360, already popular among manufacturers, startups, and makers in Taiwan, is now set to make its mark in the architecture field. "Fusion 360 will revolutionize how architects in Taiwan work," said Chin-Fu Yang, Chairman of TABC. "It allows for seamless integration with existing workflows and paves the way for smarter buildings, communities, and cities in the future." Jui-Lin Chen, Director of the Architecture and Building Research Institute, emphasized the growing importance of BIM in modern architecture. "BIM is a key driver in smart construction," he noted. "The Ministry of the Interior is pushing for broader adoption of BIM in public projects, aligning with global trends in smart infrastructure." This agreement marks another milestone in Autodeskâ€™s long-term efforts to support the design and construction industries in Taiwan. It builds upon previous initiatives like the â€œDesign Dream Voyageâ€ program, which encourages K-12 students to explore creativity using advanced design software. "Autodesk is committed to advancing 3D design skills across Taiwan," said Richard Li, Managing Director of Autodesk Greater China. "We are proud to collaborate with TABC to bring our expertise to the architecture sector and help it reach new levels of innovation."
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